公司自成立以来始终秉持"技术立企"核心战略，构建了"战略引领-平台支撑-团队驱动-技术突破"的全链条研发体系。
目前设有独立技术中心统筹全链条研发工作，研发团队规模超300人，核心研发骨干均为从业10年以上的行业资深专家，深度掌握产业链技术演进脉络与市场前沿需求，具备对行业技术趋势的前瞻性预判能力与市场需求的技术转化能力。
| Technology Roadmap 技术路线 | |||||
|---|---|---|---|---|---|
| inch [mm] | 标准 | 批量 | 样品 | 研发 | |
| 关键属性 | 层数 | Up to 32L | Up to 40L | Up to 70L | >70L |
| 最小/最大厚度 | .012” [.30]/.200" [5.0] | .008" [.20]/.315" [8.0] | .006” [.15]/.315" [8.0] | TBD/≥.394" [10.0] | |
| 最大 pnl 尺寸 | 24x28[610x712] | 24x30 [610 x 760] | 26.7x47.2 [680 x 1200] | 待定 | |
| 最小线宽线距（铜厚） | 内层 | .003" [.076] H | .0025" [.064] H | <.002" [.05] H | <.002" [.05] H |
| 外层 | .004" [.10] 1 | .003" [.076] 1 | <.0025" [.064] 1 | <.0025" [.064] 1 | |
| 公差 | ±.0005" [.013] | ±.0003" [.008] | ±.00025" [.005] | ±.0002" [.005] | |
| 机械孔大小 | 最小钻咀 | .008" [.20] | .006" [.15] | .005" [.13] | .004" [.10] |
| 孔pad直径 | +.008" [.20] | +.008" [.20] | +.006" [.15] | .004" [.10] | |
| 厚径比 | 25:1 | 30:1 | 40:1 | ＞40:1 | |
| Base copper weights: 1=1oz H=1/2 oz, T=3/8 oz, Q=1/4 oz | |||||
| 孔结构 | 镭射孔层 | 3+N+3 | 7+N+7 | ELIC | UNiFYi MVs |
| 埋孔 | Yes | Yes | Yes | Yes | |
| 叠孔 | Stacked/Staggered | Offset/Staggered | Offset/Staggered | Offset/Staggered | |
| 镭射孔 | 最小孔 | .004" [.10] | .003" [.076] | .002" [.05] | .002" [.05] |
| 孔pad直径 | +.006" [.15] | +.004" [.10] | +.003" [.76] | +.003" [.076] | |
| 厚径比 | 0.8:1 | 0.8:1 | 1:1 | 1.2:1 | |
| 导通&非导通填孔 | 最小孔径 | .008" [.20] | .006" [.15] | .005" [.13] | <.005" [.13] |
| 厚径比 | 25:1 | 30:1 | 40:1 | ＞40:1 | |
| 阻焊 | 对位精度 | ±.002" [.05] | ±.0015" [.038] | ±.001" [.025] | Tangency |
| 最小开窗 | .004" [.10] | .003" [.076] | .002" [.05] | SMDP | |
| 最小绿油桥 | .003" [.0076] | .002" [.05] | .0015" [.038] | Eng Eval | |
| 表面处理 | OSP, LF HASL | Thick Gold & Multiple Finishes | 待定 | ||
| Im Sn, Im Ag, ENIG, ENEPIG | |||||
| Hard Gold, Flash Gold | |||||
| Multiple Finishes | |||||
| 物料选择 | High frequence: Rogers 3000/4000, TFA300 series, F4BME series, mmWave 77 | ||||
| High speed: MEGTRON series (M2-M8), @EMC, @ITEQ, @TUC, @ISOLA, @AGC.etc | |||||
| High Tg: IT180A, S1000-2M, TU865,EM370(Z), @ISOLA, @AGC.etc | |||||
| Others:Buried Capacitance, Buried resistor, Polyimid, High Thermal Conductive, Halogen Free Materials,.etc | |||||
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